VITA Technologies
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  News  New Products  Double Rail Extrusions For Rugged Subracks Now Offered By Pixus Technologies
New Products

Double Rail Extrusions For Rugged Subracks Now Offered By Pixus Technologies

Justin MollJustin Moll—February 29, 20160
FacebookX TwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail

More stories

X-ES Unveils Convection-Cooled Sub-½ ATR Box for Rugged Military Applications

April 27, 2011

Pentek Introduces New Series of Sentinel Intelligent Signal Scanning Recorders

June 28, 2016

Dallas Logic Announces Quad, A/D FPGA Mezzanine Card (FMC)

July 30, 2009

United Electronic Industries announces the release of the DNx-AO-358 simulated strain gage output boards

March 26, 2010



Pixus Technologies, a provider of embedded computing and enclosure solutions, now offers double rail extrusions with dual mounting. The rails provides the modular framework for electronics enclosures.

The Pixus double rails feature mounting holes for a second screw, providing more stability and strength for a modular enclosure. The rails have been tested and used in German railway applications for high resistance to shock/vibration and the ability to handle extreme loads. The extruded aluminum rails come in front and rear versions and with various interfaces. There are sets of 1HP pitch patterns of 2.5M tapped holes for snapping in card guides and mounting backplanes. Pixus’ rails can be cut in any length to provide virtually unlimited subrack configurations.

Pixus also offers standard single-mount front and rear rails for modular enclosures. The company has a vast selection of related components including card guides, ESD clips, side panels, front panels, ejector handles, mounting flanges, and more.

FacebookX TwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail
SatCom Capabilities in APAC to be discussed by US Air Force, Australian Defence Force, Ministry of Defence Malaysia, New Zealand Defence Force and many more at MilSatCom Asia-Pacific 2016
Intel Embedded Innovator
Related posts
  • Related posts
  • More from author
Articles

How the VITA 100 Collaboration Is Shaping the Next Generation of Embedded Systems

February 11, 20260
Eletter Products

SPONSORED: 3U VPX HD Switch Doubles Backplane Density

February 3, 20260
Eletter Products

SPONSORED: V3211 Versal Gen 2 VITA 93 SOM

February 3, 20260
Load more
Read also
Articles

How the VITA 100 Collaboration Is Shaping the Next Generation of Embedded Systems

February 11, 20260
Eletter Products

SPONSORED: 3U VPX HD Switch Doubles Backplane Density

February 3, 20260
Eletter Products

SPONSORED: V3211 Versal Gen 2 VITA 93 SOM

February 3, 20260
Eletter Products

SPONSORED: VITA 67.3 Offerings from Teledyne Storm Microwave

February 3, 20260
Eletter Products

SPONSORED: SAVE Compliant Chassis for VPX and SOSA Aligned Systems

February 1, 20260
New Products

VITA 93 module group launches for use in demanding embedded applications

January 27, 20260
Load more

Recent Comments

No comments to show.
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX

© 2023 VITA Technologies. All rights Reserved.