VITA Technologies
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  News  New Products  Double Rail Extrusions For Rugged Subracks Now Offered By Pixus Technologies
New Products

Double Rail Extrusions For Rugged Subracks Now Offered By Pixus Technologies

Justin MollJustin Moll—February 29, 20160
FacebookX TwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail

More stories

Highly Flexible Cables Deliver Exceptional Performance for Unmanned Aircraft Applications

November 7, 2011

Pentek’s Programmable Multi-frequency Clock Synthesizer Offers System Flexibility and Quick Delivery

July 27, 2010

Mentor Graphics Announces Commercial Linux Platform for Freescale Semiconductor’s Processors Based on Power Architecture Technology; Support for New QorIQ P3 and P5 Platform

June 22, 2010

RISC Embedded Computing with Unmatched I/O and Windows CE 6.0

May 6, 2009



Pixus Technologies, a provider of embedded computing and enclosure solutions, now offers double rail extrusions with dual mounting. The rails provides the modular framework for electronics enclosures.

The Pixus double rails feature mounting holes for a second screw, providing more stability and strength for a modular enclosure. The rails have been tested and used in German railway applications for high resistance to shock/vibration and the ability to handle extreme loads. The extruded aluminum rails come in front and rear versions and with various interfaces. There are sets of 1HP pitch patterns of 2.5M tapped holes for snapping in card guides and mounting backplanes. Pixus’ rails can be cut in any length to provide virtually unlimited subrack configurations.

Pixus also offers standard single-mount front and rear rails for modular enclosures. The company has a vast selection of related components including card guides, ESD clips, side panels, front panels, ejector handles, mounting flanges, and more.

FacebookX TwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail
SatCom Capabilities in APAC to be discussed by US Air Force, Australian Defence Force, Ministry of Defence Malaysia, New Zealand Defence Force and many more at MilSatCom Asia-Pacific 2016
Intel Embedded Innovator
Related posts
  • Related posts
  • More from author
Articles

How the VITA 100 Collaboration Is Shaping the Next Generation of Embedded Systems

February 11, 20260
Eletter Products

SPONSORED: 3U VPX HD Switch Doubles Backplane Density

February 3, 20260
Eletter Products

SPONSORED: V3211 Versal Gen 2 VITA 93 SOM

February 3, 20260
Load more
Read also
Articles

How the VITA 100 Collaboration Is Shaping the Next Generation of Embedded Systems

February 11, 20260
Eletter Products

SPONSORED: 3U VPX HD Switch Doubles Backplane Density

February 3, 20260
Eletter Products

SPONSORED: V3211 Versal Gen 2 VITA 93 SOM

February 3, 20260
Eletter Products

SPONSORED: VITA 67.3 Offerings from Teledyne Storm Microwave

February 3, 20260
Eletter Products

SPONSORED: SAVE Compliant Chassis for VPX and SOSA Aligned Systems

February 1, 20260
New Products

VITA 93 module group launches for use in demanding embedded applications

January 27, 20260
Load more

Recent Comments

No comments to show.
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX

© 2023 VITA Technologies. All rights Reserved.