VITA Technologies
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
Menu
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • Articles
  • White Papers
  • Products
  • News
Menu
  • Articles
  • White Papers
  • Products
  • News
  New Products  Pixus Announces New Conduction Cooled ATRs and Specialty Enclosures
New Products

Pixus Announces New Conduction Cooled ATRs and Specialty Enclosures

Pixus TechnologiesPixus Technologies—May 3, 20160
FacebookTwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail

More stories

Mercury Computer Systems Enables Scalable, Cost-Effective Solutions with New MicroTCA Platform

May 27, 2010

Curtiss-Wright’s New Rugged Dual GPGPU OpenVPX(tm) Module is Industry’s First to Deliver 5 TFLOPS Performance for Deployed Radar, SIGINT, EO/IR Applications

April 7, 2016

Queplix Data Virtualization Platform Integrates with Facebook, Linkedin, And Google Contacts to Enhance Business Functions with the Power of Social Media

January 13, 2011

Deployable rugged conduction cooled VPX boards available based on Intel(r) E3800 series Atom(tm) processor

December 16, 2014



Pixus Technologies, a provider of embedded computing and enclosure solutions, now offers conduction cooled chassis in the ATR format or in specialty Small Form Factor (SFF) designs. Enclosures formats are available for both OpenVPX and MicroTCA architectures.

The Pixus conduction-cooled ATRs come in standard 1/2 and 3/4 sizes for 3U or 6U boards. There are also options for the MicroTCA.3 Hardened form factor as well as heat exchanged versions. The enclosures are designed to meet MIL-STD-704, MIL-STD-810G, and MIL-STD-461. Off-the-shelf power interface boards are available to easily incorporate VITA 62 or PICMG 2.9 power supplies. For specialty designs or those looking to minimize Size, Weight, and Power (SWaP), Pixus also offers application-specific conduction cooled solutions.

Pixus provides rugged and 19” rackmount enclosures in multiple backplane architectures including OpenVPX, MicroTCA, AdvancedTCA, and legacy CompactPCI/VME. The company also provides specialty backplanes and handle/panel sets for embedded boards.

FacebookTwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail
Modular Open Radio Frequency Architecture boot camp
Power Sources Manufacturers Association Welcomes Advanced Thermal Solutions, Inc.
Related posts
  • Related posts
  • More from author
Articles

DÉJÀ VU – THE UBIQUITY OF VITA 57

August 23, 20230
Conferences and Awards

Attn. VITA members: Registration open for September 2023 VSO Face to Face

August 16, 20230
Press Release

TEWS Technologies’ Advanced FPGA Solution Empowers a Range of Digital and Analog Applications

August 16, 20230
Load more
Read also
Articles

DÉJÀ VU – THE UBIQUITY OF VITA 57

August 23, 20230
Conferences and Awards

Attn. VITA members: Registration open for September 2023 VSO Face to Face

August 16, 20230
Press Release

TEWS Technologies’ Advanced FPGA Solution Empowers a Range of Digital and Analog Applications

August 16, 20230
Eletter Products

SPONSORED: TXMC637 – Reconfigurable FPGA with Analog I/O and Digital I/O

August 9, 20230
Eletter Products

SPONSORED: SpaceVPX Solutions From Pixus Technologies

August 9, 20230
Eletter Products

SPONSORED: Chassis Management Family Ensures Efficient Operation in Systems Aligned to SOSA

August 8, 20230
Load more

Recent Posts

  • DÉJÀ VU – THE UBIQUITY OF VITA 57
  • Attn. VITA members: Registration open for September 2023 VSO Face to Face
  • TEWS Technologies’ Advanced FPGA Solution Empowers a Range of Digital and Analog Applications
  • SPONSORED: TXMC637 – Reconfigurable FPGA with Analog I/O and Digital I/O
  • SPONSORED: SpaceVPX Solutions From Pixus Technologies

Recent Comments

No comments to show.
  • Articles
  • White Papers
  • Products
  • News
Menu
  • Articles
  • White Papers
  • Products
  • News
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
Menu
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX

© 2023 VITA Technologies. All rights Reserved.