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  News  Media and Education  E-cast: Reducing Avionics Packaging Up to 40%: MiniMRP Leads the Next Generation of Avionics Packaging
Media and Education

E-cast: Reducing Avionics Packaging Up to 40%: MiniMRP Leads the Next Generation of Avionics Packaging

embedded e-castembedded e-cast—December 6, 20170
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The Mini Modular Rack Principle (MiniMRP), standardized in ARINC 836, is a design and modular component solution for avionics systems that distributes avionics throughout the aircraft in smaller, lighter package configurations — reducing avionics packaging space up to 40%!

Presented by: TE Connectivity

<p><i>Speaker(s): Russ Graves (Business Development for Commercial Aerospace, TE Connectivity); Christian Cavailles (Product Manager, TE Connectivity);Christophe Prel (EMEA Business Development & Optical Flex Products Manager, TE Connectivity); Matt McAlonis (Engineering Manager, TE Connectivity)
</p>

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