VITA Technologies
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
Menu
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • Articles
  • White Papers
  • Products
  • News
Menu
  • Articles
  • White Papers
  • Products
  • News
  New Products  New molded boot flexibility delivers simplified sealed harness installation
New Products

New molded boot flexibility delivers simplified sealed harness installation

TE ConnectivityTE Connectivity—May 31, 20180
FacebookTwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail


The next generation INSTALITE molded boots with Rayaten shielding by TE Connectivity

The next generation INSTALITE molded boots with Rayaten shielding by TE Connectivity
More stories

New Aitech Rad-tolerant PMC Provides Gigabit Ethernet Data Transport to CPU

December 13, 2010

Themis Computer Launches New Mission and Payload Systems Products

May 7, 2010

Paralan rolls out the SD100 SCSI Extender Kits for ABB Symphony Harmony Industrial Control Networks

May 24, 2011

Pentek’s Talon Recorders’ SystemFlow Software Touts New Features and Enhancements

April 26, 2017

TE Connectivity (TE), a world leader in connectivity and sensors, is pleased to introduce the next generation of INSTALITE molded boots with Rayaten shielding for harnessing applications that need EMI shielding. Designed with new flexible EMI shielding materials, Rayaten shielding heat-shrinkable boots are easier to install yet maintain the original Rayaten EMI-shielding and ruggedized design.

TE’s next generation INSTALITE molded boots are both easier to install and less craft sensitive because of their new flexible EMI shielding. This shielding helps reduce the risk of cracking and speeds up recovery from the heat shrinking process. The new EMI shielding material also allows TE to offer an expanded range of configurations, including several T-shape options and multiway harness breakouts.

“Next generation Rayaten shielding combines the same fluid-resistant exterior with new EMI shielding material to create a rugged boot that can withstand harsh military and aerospace environments,” said Mark Taylor, product manager for TE’s Aerospace, Defense and Marine division. “As a provider of end-to-end sealed harnessing solutions, it’s important for TE to continue engineering lighter, simpler, better products for our customers.”

The next generation INSTALITE molded boots with Rayaten shielding provide >70 dB of attenuation for a frequency range of 3 kHz to 1GHz and EMI continuity from harness braid through the backshell. Each boot is environmentally sealed and designed to resist abrasion as well as damage from most military fuels, oils and greases. INSTALITE boots are available in standard -25 (System 25) compound and -100 (System 100) Zero Halogen, LFH compound.

For more information on TE’s INSTALITE molded boots with Rayaten shielding, visit te.com/rayaten or contact the Product Information Center at 1-800-522-6752.

FacebookTwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail
Abaco Wins Orders to Help Equip Medium Altitude Unmanned Vehicle
Curtiss-Wright Delivers Performance Breakthrough for VxWorks-based HPEC Systems with Support for Intel(r) Xeon(r) D processor DMA Engine with 40 GbE
Related posts
  • Related posts
  • More from author
Articles

DÉJÀ VU – THE UBIQUITY OF VITA 57

August 23, 20230
Conferences and Awards

Attn. VITA members: Registration open for September 2023 VSO Face to Face

August 16, 20230
Press Release

TEWS Technologies’ Advanced FPGA Solution Empowers a Range of Digital and Analog Applications

August 16, 20230
Load more
Read also
Articles

DÉJÀ VU – THE UBIQUITY OF VITA 57

August 23, 20230
Conferences and Awards

Attn. VITA members: Registration open for September 2023 VSO Face to Face

August 16, 20230
Press Release

TEWS Technologies’ Advanced FPGA Solution Empowers a Range of Digital and Analog Applications

August 16, 20230
Eletter Products

SPONSORED: TXMC637 – Reconfigurable FPGA with Analog I/O and Digital I/O

August 9, 20230
Eletter Products

SPONSORED: SpaceVPX Solutions From Pixus Technologies

August 9, 20230
Eletter Products

SPONSORED: Chassis Management Family Ensures Efficient Operation in Systems Aligned to SOSA

August 8, 20230
Load more

Recent Posts

  • DÉJÀ VU – THE UBIQUITY OF VITA 57
  • Attn. VITA members: Registration open for September 2023 VSO Face to Face
  • TEWS Technologies’ Advanced FPGA Solution Empowers a Range of Digital and Analog Applications
  • SPONSORED: TXMC637 – Reconfigurable FPGA with Analog I/O and Digital I/O
  • SPONSORED: SpaceVPX Solutions From Pixus Technologies

Recent Comments

No comments to show.
  • Articles
  • White Papers
  • Products
  • News
Menu
  • Articles
  • White Papers
  • Products
  • News
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
Menu
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX

© 2023 VITA Technologies. All rights Reserved.