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  Eletter Products  SPONSORED: FlexVNX+ Platform for VITA 90 (VNX+) Test & Development
Eletter Products

SPONSORED: FlexVNX+ Platform for VITA 90 (VNX+) Test & Development

Elma ElectronicElma Electronic—October 15, 20240
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The first of its kind, the FlexVNX+ platform will help developers design and build boards based on VNX+ (VITA 90), a rugged, small form factor architecture that leverages the Eurocard connector system and features a significantly smaller footprint than 3U VPX.

The new VNX+ standard defines an extremely compact footprint that reduces per-slot size by up to 70% over 3U VPX, making it ideal for space constrained applications, especially in rugged environments.

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The benefits of VITA 90 standard, or VNX+, include high speed communications, with data rates up to 25 Gbps between modules per lane, within a scalable, modular architecture enables exceptional design flexibility for critical defense applications.

The portable FlexVNX+ development chassis accelerates the development and testing of VNX+ plugin cards (PICs) aligned to VITA 90 and The Open Group SOSA™ Technical Standard.

These next generation of test platforms will keep customers on the cutting edge of system development, saving on engineering time and costs.

Specific uses of the new FlexVNX+ include mission control, secure communications, surveillance and data and image processing as well as weapons and navigational control, target tracking and display and threat detection.

FlexVNX+ Features:
Supporting up to 10GBASE-KX/40GBASE-KX4 Ethernet and PCI Gen 4, the system’s 8-slot backplane features six defined payload slots that accommodate a range of PICs, one switch slot and a PSU slot. An internal power supply, Gigabit Ethernet switch, a VITA 46.11 chassis manager, maintenance port aggregator and extensive front panel I/O round out the chassis’ high-performance capabilities.

The unit features ergonomic handles for easy transport, a five-degree tilted card cage and locking retainers to secure modules in slots against blind-mate connector spring forces. It uses directed air to cool modules either with or without metal enclosures, and offers built-in I/O, including unique external I/O (UEIO) direct device control without additional mezzanine cards.

Click here to learn more.

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SPONSORED: Advanced SBC powered by NVIDIA® Jetson AGX Orin™ Industrial
SPONSORED: Rugged Test Chassis for VPX / SOSA Aligned Payloads
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