VITA Technologies
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  News  New Products  New ATS Heat Sinks Feature Push Pin Mounting
New Products

New ATS Heat Sinks Feature Push Pin Mounting

Advanced Thermal Solutions, IncAdvanced Thermal Solutions, Inc—July 19, 20110
FacebookX TwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail



Each heat sink comes with a pair of durable plastic or brass push. The pins run through opposite corners of the heat sinks and mount securely into 3.00 mm holes in the PCB laid out in industry standard patterns. Plastic pins are lighter and non-electrically conductive; brass pins have added strength and durability for more rugged applications or thicker devices. An integral spring on each pin provides approximately 2 lbs of retention load, depending on the height of the component and the PCB thickness.

More stories

Retail Sales of Electrical and Electronics Specialists in Saudi Arabia

August 20, 2016

NEW Rugged, conduction cooled 3U UPS based on our "Desert Gecko" chassis system.

June 10, 2011

Altera Unveils 28-nm Stratix V FPGA Family

April 19, 2010

LDRA and Netrino Partner to Offer a Static Analysis Tool that enforces the Embedded C Coding Standard

April 14, 2010

The patented ATS maxiFLOW sinks feature a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling in the restricted airflow conditions typical of today’s condensed electronic packages. The heat sinks are fabricated from light weight, extruded aluminum which minimizes thermal resistance from the base to the fins. They have a protective green anodized surface.

Tests on maxiFLOW heat sinks with an airflow rate of just 100 lfm (linear feet per minute) show that device junction temperatures (Tj) can be reduced by more than 40 percent below the temperatures achieved using conventional straight-fin heat sinks.

The push pin mount maxiFLOW heat sinks are available in sizes ranging from 37.4 x 37.5 x 10.0 mm (L x W x H) up to 41.4 x 45.75 x 24.5 mm (L x W x H). Each maxiFLOW heat sink is provided preassembled with a Chomerics T766 phase change thermal interface material (TIM) for improved component-to-sink thermal transfer. The pad is centered on the base of the sink.

Prices for ATS push pin mounted heat sinks start at $3.56 in high volume. More information on push pin heat sinks is found on Qats.com or by calling 781-769-2800.

About Advanced Thermal Solutions

Advanced Thermal Solutions is a leading engineering and manufacturing company supplying complete thermal and mechanical packaging solutions from analysis and testing to final production. ATS provides air and liquid cooling solutions, laboratory-quality thermal instrumentation, along with thermal design consulting services and training. Qats.com

FacebookX TwitterPinterestLinkedInTumblrRedditVKWhatsAppEmail
Falcon Electric Enhances Uninterruptible Power Supply (UPS) Communications with Addition of Advanced SNMP/HTTP Agent
Curtiss-Wright Controls Electronic Systems Introduces New Family of Network Attached Storage File Servers
Related posts
  • Related posts
  • More from author
Eletter Products

SPONSORED: 3U VPX HD Switch Doubles Backplane Density

August 1, 20250
RTS rugged test and deployment system
Eletter Products

SPONSORED: Rugged Test and Deploy Systems for VPX and SOSA Aligned Payloads

July 25, 20250
Articles

The VITA Technologies 2025 Resource Guide is here!

June 19, 20250
Load more
Read also
Eletter Products

SPONSORED: 3U VPX HD Switch Doubles Backplane Density

August 1, 20250
RTS rugged test and deployment system
Eletter Products

SPONSORED: Rugged Test and Deploy Systems for VPX and SOSA Aligned Payloads

July 25, 20250
Articles

The VITA Technologies 2025 Resource Guide is here!

June 19, 20250
Articles

Next-gen fiber optics for aviation: Expanded Beam performance with VITA 95/96

June 3, 20250
Articles

Embedded Tech Trends 2025 Wrapup

June 3, 20250
Consortia and Working Groups

VITA standards activity updates

June 3, 20250
Load more

Recent Comments

No comments to show.
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX

© 2023 VITA Technologies. All rights Reserved.