Ottawa, Ontario – August 17, 2005 – Tundra Semiconductor Corporation (TSX:TUN), the leader in System Interconnect, today announced that Mr. Ray Burgess has joined the Company in the position of Vice President of Strategy and Marketing. The role will focus on driving the growth strategy for the company, positioning Tundra for continued success in its target markets. Mr. Burgess comes to the position with more than 24 years of leadership experience in the semiconductor industry, including strategy formulation, marketing and general management. Most recently, he was the Senior Vice President of Strategy, Marketing and Communications at Freescale Semiconductor, Inc. helping that company through its successful Initial Public Offering (IPO) in 2004. Since the beginning of 2005, Mr. Burgess has worked closely with the Tundra leadership team in a consulting capacity.
“I welcome Ray to our management team and look forward to his contributions to our on-going growth strategy, ” said Jim Roche, President and CEO of Tundra. “ Ray’s impressive record of accomplishments and experience in business development as well as marketing will strengthen the Company.”
“I am excited to join the Tundra team and to take on this role to help accelerate the Company’s growth path,” said Ray Burgess, Vice President, Strategy and Marketing. “The System Interconnect market offers tremendous opportunities for growth and value creation, and I feel that Tundra is well positioned to capitalize on several key market trends, such as the transition from bus to switch-based fabric architectures as well as the accelerating outsourcing trend.”
Tundra Semiconductor Corporation delivers standards-based System Interconnect for use by the world’s leading vendors of wireless infrastructure, networking, storage and pervasive computing systems. Tundra System Interconnect allows customers to link critical system components while compressing development cycles and maximizing performance. For more information, please visit www.tundra.com.