VITA Technologies
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • VME
  • XMC
  • FMC
  • PMC
  • VNX
  • VPX
  • Articles
  • White Papers
  • Products
  • News
  • Articles
  • White Papers
  • Products
  • News
  News  Industry News  Radstone is First to Announce Rugged 3U VPX Products
Industry News

Radstone is First to Announce Rugged 3U VPX Products

RadstoneRadstone—June 1, 20060

More stories

Fujitsu Introduces 10G Ethernet LAN-PHY Mapper for WDM Networks

November 19, 2007

Coghlin Companies’ Columbia Tech Earns International Traffic in Arms Regulations (ITAR) Registration

May 5, 2009

Slot SBC Market Expected to Experience Growth Through 2012 Despite Potential Market Threats

June 25, 2010

Embedded Systems Design, Inc. Launches StreamBlade MiniFX FPGA Board

July 20, 2007

With its announcement of a family of products including a single board computer, a graphics accelerator platform and a Gigabit Ethernet switch, Radstone has become the first company to introduce a range of 3U VPX solutions specifically designed for the demanding environments that characterize military applications.

The SBC340 is based on the 65nm 2.0 GHz Core™ Duo T2500 (‘Yonah’) processor which is the successor to the Pentium M processor from Intel and is specifically designed for minimal power consumption: it features the 945GM Northbridge chip set, and takes full advantage of PCI Express’s 16x throughput. The GRA110 graphics board also features x16 PCIe, and supports dual channel video output. The GBX410 Gigabit Ethernet Switch is based on Radstone’s acclaimed CPX24, and features twelve Gigabit Ethernet channels and one 10 Gigabit Ethernet channel to the backplane.

All three boards are expected to ship in the third quarter.

3U VPX is expected to find substantial acceptance among military and aerospace companies for a number of reasons. Small size and low weight are becoming increasingly important considerations in the platforms of the future, such as unmanned vehicles, with growth expected to be driven by programs such as FCS (Future Combat Systems); higher integration levels mean that performance is not compromised by the smaller form factor; and heat/power dissipation remains within today’s thermal performance envelope.

Radstone

Mouser Electronics and ON Semiconductor Sign Global Distribution Agreement
Tundra Semiconductor Acquires Silicon Logic Engineering
Related posts
  • Related posts
  • More from author
Articles

Editor’s Foreword: Livin’ la Vida MOSA!

May 24, 20230
Articles

Embedded Tech Trends 2023 Wrapup

May 23, 20230
Industry News

2022 State of the VITA Technology Industry — Spring Edition

August 24, 20220
Load more
Read also

The VITA Technologies 2026 Resource Guide is here!

June 15, 20260

VITA Standards Update

June 15, 20260
Articles

VITA 100 and the next phase of embedded computing standards

June 15, 20260
Articles

VME in defense systems: A legacy of reliability, longevity, and determinism

June 15, 20260
Articles

MOSA, SOSA, and VITA explained: The standards behind VPX defense electronics

June 15, 20260
Eletter Products

SPONSORED: Mission-Ready Chassis Management Aligned to SOSA®

June 4, 20260
Load more

Recent Comments

No comments to show.
    • Articles
    • White Papers
    • Products
    • News
    • Articles
    • White Papers
    • Products
    • News
    • VME
    • XMC
    • FMC
    • PMC
    • VNX
    • VPX
    • VME
    • XMC
    • FMC
    • PMC
    • VNX
    • VPX

    © 2023 VITA Technologies. All rights Reserved.